Will Fung is an Investor at Samsung Catalyst Fund, where he is part of a team that leads investment in multi-stage disruptive companies in a variety of sectors including Robotics, AI, Data Center Infrastructure, and deep tech/frontier tech.
Prior to joining Samsung, Will was an early employee at Kovio (acquired by Thin Film), a startup that developed a printed silicon electronics platform with applications in the NFC, retail security, and display industries. At Kovio, Will held various engineering, product management, and business development roles.
Will holds an MBA from the Leavey School of Business at Santa Clara University and a B.S. in Electrical Engineering from the University of Toronto.
Will is attending / has attended:
Venture Summit | West 2020
Venture Summit Virtual Connect | Global
Venture Summit Virtual Connect 3